Heat plate with clip
US8550148B2 · kind B2 · utility
1Cited by
9References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2010 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Dec 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure of heat plate with clip includes a heat plate and at least one clip. The heat plate is a hollow body having an interior cavity containing a capillary structure and a working fluid. The heat plate has a surface forming a receiving chamber. The clip is a resilient plate having mounting sections, which are mounted to the heat plate. The mounting sections have a portion received in the receiving chamber. In this way, replacement of inside-cavity supporting structure can be realized and advantages of thinned structure, flexible adjustment of positioning, and being hard to cause stress induced deformation can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.