Electrical interconnect device

US8550825B2 · kind B2 · utility

Assignee

• Tyco Electronics Co., Ltd · US

Inventors

• Jeffery Walter Mason · Attleboro, US
• Wayne Stewart Alden, III · Whitman, US

Key dates

• Filing date: Apr 5, 2011
• Grant date: Oct 8, 2013
• Expiry date: Aug 12, 2031

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R1/0483
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An electrical interconnect device includes a substrate that has opposite first and second outer surfaces. Arrays of conductive elastomeric columns are held by the substrate. Each of the columns has opposite first and second ends. The elastomeric columns are internally conductive between the first and second ends. A shield is mounted exterior of the first outer surface of the substrate with the shield having an insulative carrier that holds an array of conductive pads arranged in a complementary pattern as the array of elastomeric columns. The conductive pads have inner surfaces and outer surfaces. The shield is positioned relative to the substrate such that the inner surfaces of the conductive pads engage the first ends of corresponding elastomeric columns. The outer surfaces are configured to engage corresponding mating contacts of an electrical component.