Pressure sensitive shrink label

US8551270B2 · kind B2 · utility

Assignee

• Avery Dennison Corporation · US

Inventors

• Richard A. Previty · Chardon, US
• James P. Lorence · Greenville, US
• Richard D. Pastor · Cincinnati, US
• Craig W. Potter · Mentor, US
• Mitchell J. Rackovan · Mentor, US
• William Lewis Cone · Weeki Wachee, US

Key dates

• Filing date: Sep 25, 2008
• Grant date: Oct 8, 2013
• Expiry date: Sep 25, 2028

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2467/006
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

A label for application to a surface having at least one compound curve is provided. The label comprises a heat shrinkable film having an inner surface and outer surface and a layer of pressure sensitive adhesive on the inner surface of the heat shrinkable film.