Method for producing light emitting diode device
US8551277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2012 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Aug 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1195
Abstract
A method for producing a light emitting diode device includes the steps of preparing a laminate including, in order, a supporting layer, a constraining layer and an encapsulating resin layer, each formed in a thickness direction; cutting the encapsulating resin layer and the constraining layer in the laminate into a pattern corresponding to the light emitting diode element; removing a portion which does not correspond to the light emitting diode element in the encapsulating resin layer and the constraining layer that are cut into the pattern; allowing the encapsulating resin layer corresponding to the light emitting diode element to be opposed to the light emitting diode element to be pressed in the direction where they come close to each other so as to encapsulate the light emitting diode element by the encapsulating resin layer; and removing the supporting layer and the constraining layer from the laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.