Electroplating system with electroplating wheel
US8551301B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2009 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Jun 14, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating system is provided for electroplating a workpiece. The system includes a plating wheel having a side and a cylindrical wall extending from the side. The plating wheel has an interior chamber that at least partially defines a solution chamber that is configured to hold an electroplating solution. The cylindrical wall includes an opening extending through the cylindrical wall into fluid communication with the interior chamber. An external anode is located proximate to and positioned outside the cylindrical wall of the plating wheel to define an electroplating work area therebetween. An internal anode is held within the interior chamber of the plating wheel and positioned to align with the work area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.