Non-electrolytic deposition method
US8551561B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2009 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | May 6, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/54
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method for the non-electrolytic deposition of a compound, preferably an electrochromic compound, comprising the following successive steps: (a) an electroconductive layer is deposited on a non-conductive solid substrate; (b) a reducing agent or an oxidizing agent (=redox agent) is deposited on an area of said electroconductive layer, said area covering only a portion of the surface of said electroconductive layer; and (c) a solution of a precursor of the compound to be deposited is brought into contact both with the redox agent and with at least a portion of the area of said electroconductive layer not covered by the redox agent, said precursor being chosen from those having an oxidation-reduction potential higher or lower than the redox agent and forming, after an oxidation-reduction reaction, a compound insoluble in the solution of the precursor of the compound to be deposited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.