Alkali developable photosensitive resin composition and dry film manufactured by the same
US8551687B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 20, 2008 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Sep 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate—based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus—based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.