Patent · US Active

Masking method

US8551883B2 · kind B2 · utility

0Cited by

2References

3Claims

0Family size

Assignee

SOLARWORLD INNOVATIONS GMBH · DE

Inventors

Holger Neuhaus · Birkenfeld, DE
Andreas Krause · Frankfurt am Main, DE
Bernd Bitnar · Freiberg, DE
Frederick Bamberg · Freiberg, DE
Reinhold Schlosser · Birkenfeld, DE

Key dates

Filing date	Jun 15, 2010
Grant date	Oct 8, 2013
Priority date	—
Expiry date	Jun 7, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24802
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a method for masking a semiconductor substrate including the following steps: providing a planar semiconductor substrate having a first side and a second side lying opposite thereto, applying a mask to at least one of the sides, an extrusion printing method being used for applying the mask.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.