Filled polyamide molding materials showing a reduced water absorption
US8552103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2010 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Feb 12, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Filled polyamide molding materials, in particular polyamide molding materials with medium filler content, are producible from a polyamide blend and for example by compounding with chopped or endless fibers on two-screw extruders, and have a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part, such as an antenna housings of stationary or mobile communication devices. These thermoplastic polyamide molding materials are suitable for manufacturing molded parts and other semi-finished or finished parts, for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.