Embedded circuit board and manufacturing method thereof
US8552302B2 · kind B2 · utility
3Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2010 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Feb 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.