LED package and method for manufacturing the same

US8552462B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• HOU-TE LIN · Hsinchu, TW
• Ming-Ta Tsai · Hsinchu, TW

Key dates

• Filing date: Dec 15, 2011
• Grant date: Oct 8, 2013
• Expiry date: Dec 15, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8585

Abstract

An LED package includes an electrode, an LED chip, and an insulation layer. The electrode includes a first electrode and a second electrode. The first electrode and the second electrode are separate from each other. The LED chips are connected to the first and second electrodes. The insulation layer covers the first and second electrodes and the LED chip. A cavity is defined in the first electrode for receiving the LED chip therein. A channel is defined between the first electrode and the second electrode. The channel communicates with the cavity and the insulation layer fills in the cavity and the channel.