Patent · US Active

Conductive compositions and processes for use in the manufacture of semiconductor devices

US8552558B2 · kind B2 · utility

2Cited by

4References

8Claims

0Family size

Assignee

E.I. DU PONT DE NEMOURS AND COMPANY · US

Inventors

Alan Frederick Carroll · Raleigh, US
Kenneth Warren Hang · Hillsborough, US
Brian J. Laughlin · Apex, US
Yueli Wang · Cary, US

Key dates

Filing date	Oct 20, 2008
Grant date	Oct 8, 2013
Priority date	—
Expiry date	Feb 17, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E10/50
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (c) fluorine-containing glass frit; dispersed in (d) organic vehicle and devices made therefrom.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.