Component placement apparatus
US8553080B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2008 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Oct 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To provide a component placement apparatus capable of preventing free operation of a mounting head within the movable region from being restricted as well as improving the mounting takt time.A component placement apparatus 1 comprising a line sensor camera 23 composed of a projector 21 for projecting inspection light in horizontal direction and a line sensor 22 for receiving the inspection light projected by the projector 21, the component placement apparatus 1 designed to move a mounting head 7 to allow a component P sucked to the suction nozzle 9 of the mounting head 7 before being mounted onto a substrate 10 to horizontally cross the optical axis 20 of the inspection light of the line sensor camera 23 to cause the line sensor camera 23 to perform imaging of the component and to determine the propriety of suction attitude of the component P with respect to the suction nozzle 9 based on the image DP of the component P obtained through imaging of the component P by the line sensor camera 23, characterized in that the projector 21 and the line sensor 22 constituting the line sensor camera 23 are arranged outside the movable region R of the mounting head 7 with respect to the base 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.