Patent · US Active

Component for reducing mechanical stress on a PCB

US8553428B2 · kind B2 · utility

0Cited by

9References

9Claims

0Family size

Assignee

Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

Lars Bolander · Mölndal, SE
Tomas Bergsten · Gothenburg, SE

Key dates

Filing date	May 24, 2007
Grant date	Oct 8, 2013
Priority date	—
Expiry date	Aug 27, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A component for mounting on a PCB, intended to support an electronics component, with an extension in the longitudinal, lateral and vertical directions. The component has a first and a second main surface, the second main surface being intended for mounting on the PCB. The component is made in a non conducting material, with a first layer of conducting material arranged on its first main surface, the conducting layer being connected to a conducting layer on the second main surface of the component by electrically conducting means. The component's extension in the vertical direction is smaller than its extension in either the longitudinal or lateral direction.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.