Laser chip package structure
US8553742B1 · kind B1 · utility
4Cited by
0References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 1, 2013 |
| Grant date | Oct 8, 2013 |
| Priority date | — |
| Expiry date | Feb 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laser chip package structure includes a printed circuit board (PCB), a flexible circuit board, a laser chip and a number of electronic elements. The PCB includes a supporting surface. The flexible circuit board is positioned on the supporting surface and electrically connected to the PCB. The laser chip is positioned on the flexible circuit board and electrically connected to the flexible circuit board. The laser chip is configured to emit a laser beam. The electronic elements are positioned on the flexible circuit board and electrically connected to the flexible circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.