Patent · US Active

RFID methods in the manufacture of reclosable packages

US8554642B2 · kind B2 · utility

0Cited by
4References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 31, 2006
Grant dateOct 8, 2013
Priority date
Expiry dateJul 1, 2032

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB65D2203/10
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

The present disclosure relates to the implanting of RFID (radio frequency identification) chips into the slider of a zipper of a reclosable package. This allows for subsequent reading of the RFID identifying data to identify associated with the reclosable package. This can be done by using the RFID data directly or by using the RFID data to access a database This can be done for authentication, security, quality control, inventory control and similar purposes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.