Method for forming hollow profiles
US8555693B2 · kind B2 · utility
0Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2006 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Mar 10, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21K1/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for forming hollow profiles is disclosed. In one exemplary method, a hollow profile is guided through a die in a processing direction and fixed by a mandrel such that at the die, the hollow profile has a material flow velocity in this processing direction (2), in which the method the mandrel has a drawing velocity in the processing direction that is greater than the material flow velocity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.