Cr-Cu alloy, method for producing the same, heat-release plate for semiconductor, and heat-release component for semiconductor
US8557015B2 · kind B2 · utility
0Cited by
2References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 14, 2007 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Jan 27, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processibility. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.