Reducing dross method of lead-free solder
US8557016B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2009 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Oct 6, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C13/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A reducing dross method of lead-free solder includes the steps of: producing master alloy of reducing dross which comprises Sn and 0.1 to 0.8 wt % P; analyzing the percentage of P of the lead-free solder to be modified, in order to reach 0.008 to 0.015 wt % P in the lead-free solder, adding the master alloy into the lead-free solder with the percentage of P less than 0.008 wt % or no P; then sampling the lead-free solder at regular intervals to determine the percentage and the percentage loss of P, if the percentage of P being less than a given value from 0.008 to 0.015 wt %, adding the master alloy to keep the percentage of P as 0.008 to 0.015 wt %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.