Patent · US Active

Method of encapsulating an electronic arrangement

US8557084B2 · kind B2 · utility

6Cited by

2References

22Claims

0Family size

Assignee

tesa SE · DE

Inventors

Klaus Keite-Telgenbüscher · Hamburg, DE
Jan Ellinger · Hamburg, DE
Thortsten Krawinkel · Hamburg, DE
Alexander Steen · Bonn, DE

Key dates

Filing date	Apr 23, 2010
Grant date	Oct 15, 2013
Priority date	—
Expiry date	Mar 7, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH10K2102/311
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.