Patterning structures using deformable substrates
US8557341B2 · kind B2 · utility
6Cited by
0References
56Claims
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Assignee
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Key dates
| Filing date | Apr 23, 2008 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Apr 13, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Aspects of the present invention describe soft imprint lithography methods capable of preparing structural features on surfaces. Disclosed methods include surmounting a deformable substrate, having an original form, with a composition, wherein the deformable substrate is capable of achieving at least one predetermined deformed state; predictably deforming said deformable substrate from its original form to the at least one predetermined deformed state; and transferring at least a portion of the composition surmounting the deformed substrate to a receiving substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.