Patent · US Active

Method for bonding a layer of silicone to a substrate of methacrylate polymer

US8557350B2 · kind B2 · utility

0Cited by
6References
17Claims
0Family size

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Key dates

Filing dateAug 13, 2008
Grant dateOct 15, 2013
Priority date
Expiry dateJan 28, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/10
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Method of bonding a layer (S) of silicone to a substrate (4′) of methacrylic polymer; the method involves positioning between the methacrylate polymer and the silicone a layer (9) of an organosilane having the formula R1Si(R2)3, in which R2 is OH and R1 is a methacrylic residue.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.