Method for bonding a layer of silicone to a substrate of methacrylate polymer
US8557350B2 · kind B2 · utility
0Cited by
6References
17Claims
0Family size
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Key dates
| Filing date | Aug 13, 2008 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Jan 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Method of bonding a layer (S) of silicone to a substrate (4′) of methacrylic polymer; the method involves positioning between the methacrylate polymer and the silicone a layer (9) of an organosilane having the formula R1Si(R2)3, in which R2 is OH and R1 is a methacrylic residue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.