Polishing pad
US8557376B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2008 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Jan 6, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249991
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad which suppresses occurrence of a scratch or a roll-off on an object to be polished so that flatness is improved is provided. A polishing pad 1 is comprised a polyurethane sheet 2 having a polishing surface P for performing polishing processing to an object to be polished and an elastic sheet 3 having elasticity joined on a surface of the polyurethane sheet 2 on the opposite side to the polishing surface P. The polyurethane sheet 2 is set higher in compressibility than the elastic sheet 3, and is set lower in A hardness than the elastic sheet 3. The elastic sheet 3 is set at 1% or more in compressibility, and is set at 90 degrees or less in A hardness. Further, both of the polyurethane sheet 2 and the elastic sheet 3 are formed to have a thickness of 0.2 mm or more. The flexibility of the polyurethane sheet 2 is exerted during polishing processing so that the polyurethane sheet 2 deforms to press the polishing surface P approximately evenly on the object to be polished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.