Method of manufacturing light emitting diode package
US8557617B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2007 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Dec 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
Abstract
A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.