Methods and apparatuses for integrated packaging of microelectromechanical devices

US8557623B2 · kind B2 · utility

Assignee

• The Board of Regents of the University of Texas System · US

Inventors

• Donald P. Butler · Dallas, US
• Zeynep Celik-Butler · Dallas, US
• Mohammad Sazadur Rahman · Gainesville, US
• Murali M. Chitteboyina · Arlington, US

Key dates

• Filing date: Jun 17, 2010
• Grant date: Oct 15, 2013
• Expiry date: Jan 31, 2031

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0145
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

Microelectromechanical systems (MEMS) packages, packaged MEMS devices, and methods for making the same are disclosed. The method may include forming a chamber sacrificial layer above an insulating layer that is coupled to a wafer. The method further may include forming a packaging layer above the chamber sacrificial layer. The method additionally may include forming one or more openings through the packaging layer. The method also may include removing the chamber sacrificial layer through the one or more openings. The method may include forming a sealing layer above the packaging layer such that the sealing layer substantially seals the one or more openings to form a hermetic cavity.