Marking CO2 laser-transparent materials by using absorption-material-assisted laser processing
US8557715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2010 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Sep 17, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a CO2 laser-transparent material having a mark on the surface thereof and the method for making the same. The method includes the following steps: providing a first substrate, which has a top surface and a bottom surface; providing a second substrate which has a top surface; putting the bottom surface of the first substrate on the top surface of the second substrate; irradiating a CO2 laser beam to the top surface of the second substrate by passing through the top surface and the bottom surface of the first substrate; and forming a mark on the bottom surface of the first substrate. The material of the mark is oxide of the second substrate or the same as the material of the second substrate. Whereby the cheap CO2 laser is utilized to form the mark on the first substrate, and the mark can be erased easily by a proper chemical for recycling the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.