Heat-dissipating resin composition used for LED light housing and heat-dissipating housing for LED lighting
US8557905B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2011 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Mar 25, 2031 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a novel heat-dissipating resin composition used for an LED light housing, the composition having excellent heat dissipation, fire retardancy, insulation properties, and molding processability as well as low specific gravity and improved whiteness. Also provided is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition. Disclosed is a heat-dissipating resin composition used for an LED light housing, comprising: 100 parts by mass of a thermoplastic resin composition (X) comprising 40 to 65% by mass of a polyamide resin (A), 33.5 to 59.8% by mass of a metal-hydroxide-based fire retardant (B), and 0.2 to 1.5% by mass of a polytetrafluoroethylene resin (C); and 5 to 200 parts by mass of an inorganic filler (Y) comprising 5 to 100% by mass of boron nitride (D) and 0 to 95% by mass of an inorganic oxide filler (E), wherein thermal conductivity is equal to or greater than 1.0 W/m·K. Also, disclosed is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.