Heat sink and assembly or module unit
US8559475B2 · kind B2 · utility
1Cited by
2References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2007 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Apr 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0061
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and which is made of a metallic material in the cooling area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.