Printed circuit board via model design for high frequency performance
US8560296B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 22, 2011 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Jan 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/116
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods herein provide for estimating a high frequency performance of a PCB via model through simulation. A via model is generated to include a representation of structures of a via, such as input and output pads, and input and output stubs. A signal path in the model is defined from an input pad of the model to an output pad of the model along a transmission line segment between the input pad and the output pad. Frequency dependent input impedance values at the input pad are generated based on one or more of the input pad diameter value, the output pad diameter value, the input stub length value, and the output sub length value. A high frequency performance of the via model is estimated based on the frequency dependent input impedance values at the input pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.