Patent · US Active

Abrasive compact

US8562702B2 · kind B2 · utility

0Cited by
1References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 23, 2008
Grant dateOct 22, 2013
Priority date
Expiry dateDec 21, 2029

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2235/9623
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

The invention relates to an abrasive compact comprising a mass of diamond particles and a silicon containing binder phase wherein the diamond particles are present in an amount less than 75 volume % and the binder phase contains less than 2 volume % unreacted (elemental) silicon. The invention further relates to a method of producing an abrasive compact including the steps of forming a feed diamond powder into a diamond preform, interposing a separating mechanism between the diamond preform and a silicon infiltrant source, heating the diamond preform and silicon infiltrant source until the infiltrant is molten and the preform and infiltrant are isothermal and allowing infiltration from the molten silicon infiltrant source to occur into the diamond preform.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.