Electroless palladium plating solution
US8562727B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2010 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Jul 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/85464
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.