Fungal modified chitosan adhesives and wood composites made from the adhesives
US8562731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2011 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Dec 7, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC12P19/04
- WIPO fieldBiotechnology
- WIPO sectorChemistry
Abstract
The present invention describes a fungal modified chitosan adhesive for binding a fibrous material and the method of producing the adhesive. The adhesive is produced by providing a chitosan containing raw material; a fungal growing medium; a fungal culture; mixing the raw material, the growing medium and the fungal culture together to produce a suspension; incubating the suspension to produce a broth comprising a modified chitosan solid, an at least partially-consumed medium liquid and a fungal residue; separating the modified chitosan solid from the liquid and the fungal residue, and dissolving the modified chitosan solid to produce the adhesive resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.