End point detecting method of metal etching and device thereof
US8562848B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2011 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Apr 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is an end point detecting method of metal etching and a device thereof. The end point detecting method of metal etching comprises: performing scan to a metal film to acquire a proportion of a transparency area of the metal film in a scanned area; judging whether the proportion of the transparency area reaches a predetermined value or not; and confirming a current etching time of the metal film as an etching end point time when the predetermined value is reached. The device comprises an acquirement module, a judgment module and a confirmation module. The acquirement module performs scan to the metal film to acquire the proportion of the transparency area. The judgment module judges whether the proportion reaches the predetermined value or not. The confirmation module confirms the current etching time of the metal film as the etching end point time when the proportion reaches the predetermined value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.