Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the same
US8563141B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2010 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Dec 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.