Polyamide moulding compound for varnish-free, tough casings with a high-gloss surface
US8563653B2 · kind B2 · utility
4Cited by
8References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2009 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Jul 6, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyamide moulding compounds for the production of unvarnished moulded articles with a high-gloss surface and outstandin toughness are provided. By means of moulded articles which are produced with very high surface quality from the moulding compounds, the complex, cost-intensive and frequently environmentally impacting varnishing processes can be avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.