Patent · US Active

Heat-aging-resistant polyamides

US8563680B2 · kind B2 · utility

2Cited by

19References

12Claims

0Family size

Assignee

BASF SE

Inventors

Manoranjan Prusty · Mannheim, DE
Martin Baumert · Dossenheim, DE
Bernd Bruchmann · Ludwigshafen, DE
Anna Cristadoro · Heppenheim, DE

Key dates

Filing date	Jun 10, 2011
Grant date	Oct 22, 2013
Priority date	—
Expiry date	Jul 22, 2031

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K7/14
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding compositions, comprising

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.