Thin-film heterostructure thermoelectrics in a group IIA and IV-VI materials system
US8563844B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 9, 2012 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Mar 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/80
Abstract
Embodiments of a thin-film heterostructure thermoelectric material and methods of fabrication thereof are disclosed. In general, the thermoelectric material is formed in a Group IIa and IV-VI materials system. The thermoelectric material includes an epitaxial heterostructure and exhibits high heat pumping and figure-of-merit performance in terms of Seebeck coefficient, electrical conductivity, and thermal conductivity over broad temperature ranges through appropriate engineering and judicious optimization of the epitaxial heterostructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.