Optoelectronic semiconductor component and method of producing an optoelectronic semiconductor component

US8563998B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Walter Wegleiter · Nittendorf, DE
• Ralph Wirth · Lappersdorf, DE
• Bernd Barchmann · Regensburg, DE

Key dates

• Filing date: Mar 26, 2009
• Grant date: Oct 22, 2013
• Expiry date: Aug 29, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857

Abstract

An optoelectronic semiconductor component includes a connection support with a connection side, at least one optoelectronic semiconductor chip mounted on the connection side and electrically connected to the connection support, an adhesion-promoting intermediate film applied to the connection side and covering the latter at least in selected places, and at least one radiation-transmissive cast body which at least partially surrounds the semiconductor chip, the cast body being connected mechanically to the connection support by the intermediate film.