LED package

US8564003B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• Chih-Hsun Ke · Hsinchu, TW
• Ming-Ta Tsai · Hsinchu, TW
• CHAO-HSIUNG CHANG · Hsinchu, TW
• Shiun-Wei Chan · Hsinchu, TW

Key dates

• Filing date: Nov 20, 2011
• Grant date: Oct 22, 2013
• Expiry date: Jan 19, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8515

Abstract

An LED package comprises a substrate, a reflector, a light-absorbable layer, an encapsulation layer and an LED chip. The reflector comprises a first incline with an inclined angle surrounding the LED chip. The light-absorbable layer comprises a second incline with another inclined angle direct to the LED chip, wherein the inclined angle of the second incline is greater than that of the first incline and the inclined angle of the first incline is between 90 to 150 degrees.