High-frequency module and method of manufacturing the same, and transmitter, receiver, transceiver, and radar apparatus comprising the high-frequency module
US8564477B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2009 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Mar 3, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a waveguide. The substrate has an input-output portion for high-frequency signals on one surface thereof. The circuit board has a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The waveguide has openings at ends thereof, in which one of the openings is connected to the end face of the dielectric waveguide line, and the other opening is connected to the input-output portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.