High-frequency module and method of manufacturing the same, and transmitter, receiver, transceiver, and radar apparatus comprising the high-frequency module
US8564478B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2009 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Mar 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/08
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a resonator. The substrate has an input-output portion for high-frequency signals formed on one surface thereof. The circuit board includes a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The resonator includes input-output end portions for high-frequency signals at ends thereof, in which one of the input-output end portions is connected to the end face of the dielectric waveguide line, and the other thereof is connected to the input-output portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.