Component arrangement and method for production thereof

US8564969B2 · kind B2 · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Hans-Hermann Oppermann · Berlin, DE
• Matthias Klein · Poughkeepsie, US
• Michael Toepper · Berlin, DE
• Juergen Wolf · Schlieben, DE

Key dates

• Filing date: Feb 19, 2010
• Grant date: Oct 22, 2013
• Expiry date: Aug 20, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/10
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second contact element and the contact elements each has a contact surface connected such as to give an electrical contact and a protective layer connecting the first and second substrate together. During production the protective layer is structured such that a part surface of the first substrate and a part surface of the at least one second substrate are not covered, wherein the part surfaces include the contact surfaces of the at least one first and second contact elements and the contact generated between the contact surfaces is hence not contaminated by the protective layer. The contact surfaces are thus freely accessible without elements of the protective layer lying therebetween. An improved electrical conductivity with constant mechanical stability is thus generated.