Implantable medical device and method of molding
US8565884B2 · kind B2 · utility
3Cited by
10References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2011 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Jan 4, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/753
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An implantable medical device that includes a first molded portion and a second molded portion fusion bonded to the first molded portion at an interface. The molded portions each are based on a moldable plastic material. A component, e.g., an electrical component, for the implantable device has at least one section disposed at the fusion-bonded interface of the first molded portion and the second molded portion so that the electronic component is fusion bonded to one or both portions at the interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.