Method of manufacture of multi-layer wire structure
US8567048B2 · kind B2 · utility
146Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2011 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Sep 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49195
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.