Pressure sensor having a piezoresistive sensor chip element

US8567256B2 · kind B2 · utility

Assignee

• Kistler Holding AG · CH

Inventors

• Ulrich Albicker · Laichingen, DE
• Christof Sonderegger · Zürich, CH
• Peter C. Meister · Lake Park, US
• Jochen Von Berg · Neftenbach, CH
• Rene Tanner · Seuzach, CH
• Jeffrey M. Schnellinger · Clarence, US

Key dates

• Filing date: Aug 29, 2011
• Grant date: Oct 29, 2013
• Expiry date: Aug 29, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/73265
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A piezoresistive sensor chip element of a pressure sensor has lower face with an outer edge, an adhesion area and a non-adhesion area. The chip has a closed chip cavity for measuring the pressure of a medium flowing around the chip. The upper face of a substrate is fastened only at the adhesion area of the chip. The non-adhesion area extends at least over a circular area arranged centrally on the lower face and covers a third of the lower face's total area and extends over at least one connection area from the circular area to the edge of the lower face. The pressure in the pressure medium can spread through the connection area into a space under the non-adhesion area on the element lower face. The substrate has a recess located centrally under the sensor chip element.