Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof

US8568867B2 · kind B2 · utility

Assignee

• Sabic Innovative Plastics B.V. · NL

Inventors

• Kwok Pong Chan · Troy, US
• Erik Hagberg · Decatur, US
• Tara J. Mullen · Greenwood, US
• Roy Ray Odle · Greenwood, US

Key dates

• Filing date: Jun 6, 2007
• Grant date: Oct 29, 2013
• Expiry date: Aug 6, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31721
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4′-oxydiphthalic dianhydride, 3,3′-oxydiphthalic dianhydride, 4,4′-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4′-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.