Patent · US Active

Method for dry chemical treatment of substrates and also use thereof

US8569175B2 · kind B2 · utility

1Cited by
9References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 6, 2006
Grant dateOct 29, 2013
Priority date
Expiry dateApr 28, 2029

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24479
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

The invention relates to a method for dry chemical treatment of substrates selected from the group comprising silicon, ceramic, glass, and quartz glass, in which the substrate is treated in a heated reaction chamber with a gas which contains hydrogen chloride as etching agent, and also to a substrate which can be produced in this way. The invention likewise relates to uses of the previously mentioned method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.