Flexible printed circuit board
US8569629B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2010 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Dec 30, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09318
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An FPC board includes a base insulating layer. A plurality of wiring traces are formed on the base insulating layer. The adjacent wiring traces are arranged at a distance d from each other, and each wiring trace has a predetermined width and a thickness t1. Each transmission line pair is constituted by the two adjacent wiring traces of the plurality of wring traces. A ratio of the thickness t1 of the wiring trace to the distance d between the adjacent wiring traces is set to 0.8 or more. A cover insulating layer may be formed on the base insulating layer to cover the wiring traces. A metal layer having a predetermined thickness may be provided on a back surface of the base insulating layer. Furthermore, a differential impedance of each transmission line pair may be set to 100 Ω.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.