Semiconductor device and manufacturing method thereof
US8569892B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2009 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | May 11, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: at least one semiconductor element having electrode terminals; a metal plate supporting the semiconductor element; and a wiring board covering the semiconductor element and including a plurality of insulating layers and wiring layers alternately stacked and external connection terminals on a surface, the wiring layers being electrically connected to each other by vias. The electrode terminals and the external connection terminals are electrically connected via at least one of the wiring layers and the vias. At least one of the electrode terminals, the is wiring layers, and the vias is electrically connected to the metal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.