Assembly of chip antenna and circuit board
US8570234B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2011 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Jan 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/38
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An assembly of a chip antenna and a circuit board includes a chip antenna and a circuit board. The circuit board includes a ground layer. The ground layer includes a hollow region formed adjacent to a periphery of the ground layer. The hollow region of the ground layer can be used for configuring an input impedance of the circuit board. The chip antenna is disposed in the hollow region of the ground layer, electrically connecting to the ground layer. The chip antenna includes input impedance. The input impedance of the chip antenna is adjustable to achieve a conjugate impedance match between the chip antenna and the circuit board such that the circuit board and the chip antenna can simultaneously radiate electromagnetic energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.